Application of Ultrasonic Bonding in Leds and Led Lamps Production
Статья в журнале
This article presents the results of studies of the effect ultrasonic bonding on the current-voltage characteristic nitrides chips with using methods of planning the experiment.
Журнал:
- Journal of Nano- and Electronic Physics
- Sumy State University (Сумы)
- Индексируется в Scopus
Библиографическая запись: Application of ultrasonic bonding in leds and led lamps production / Afonin K. N. [et. al.] // Journal of Nano- and Electronic Physics. - №7 (4) – 2015. - P. 04029-1-04029-2.
Ключевые слова:
CURRENT-VOLTAGE CHARACTERISTIC OF THE LED NITRIDE CHIP PLANNING EKSPERIMENT ULTRASONIC MICROWELDINGИндексируется в: