The Efficiency of Conductor Placement in Circuits with Single Modal Redundancy in Differential and Common Modes

Статья в сборнике трудов конференции

This article presents the results of selecting, justifying, and optimizing the cross section parameters for a modal filter (MF) with single modal redundancy (MR). This filter is employed for protecting circuits from interfering ultrashort pulses (UPS) in differential and common mode. The results demonstrate that the attenuation coefficient in the differential and common modes depends on the width of the active conductor and the distance between the structures. As a result, we present their optimal values. It is shown that the location of primary (reserved) and secondary (reserving) conductors in a four-wire MF has a significant impact. The smallest voltage value at the MF output is observed when EMF sources are connected to the most remote conductors both in differential and in common mode for four types of pulses. Insertion loss values in differential mode were minus 5.19, 11.57, 5.26, and 5.22 dB, while in common mode - minus 5.45, 11.7, 5.65, and 5.65 dB for trapezoidal, digitized, unipolar and bipolar action, respectively. Switching to closer pairs of conductors degrades insertion loss levels by 0.57-0.76 dB for common mode, and 0.61-0.82 dB for differential modes, depending on the selected lines.

Библиографическая запись: Lakoza, A. M. The Efficiency of Conductor Placement in Circuits with Single Modal Redundancy in Differential and Common Modes [Electronic resource] / A. M. Lakoza, V. P. Kosteletsky // Proceedings th of the 2023 IEEE 24 International Conference of Young Professionals in Electron Devices and Materials (EDM) (Novosibirsk, Russian Federation, 29 June 2023 - 03 July 2023). – New York City : IEEE, 2023. – P. 1210-1214. – DOI: 10.1109/EDM58354.2023.10225177

Конференция:

• 2023 IEEE 24th International Conference of Young Professionals in Electron Devices and Materials (EDM)
• Россия, Новосибирская область, Новосибирск, 29 июня-03 июля 2023,
• Международная

Издательство:

IEEE

США, New York, New York City