Frequency Characteristics of PCB with Modal Reservation before and after Failure Using TALGAT

Статья в сборнике трудов конференции

This paper considers the frequency characteristics of printed circuit boards with modal reservation before and after failure. Four boards prototypes (without modal reservation, and with modal reservation before and after short and open circuit failures) were modeled in the TALGAT system, and then their layouts were designed to experimentally study their features. The frequency dependences of S-parameters were obtained for all boards. The measured and the calculated results were compared and demonstrated consistency. These results proved the possibility of using the TALGAT system for solving such problems. It was revealed that the level of transmission ratio for the board with modal reservation is lower than for the board without it even after failures without affecting the useful signal, except some frequencies of the studied domain, due to the frequency shifting. It confirms the possibility of using the modal reservation layout and tracing approach for both ensuring electromagnetic compatibility and improving the reliability of radioelectronic devices. This research also confirms the importance of building a more accurate model to simulate the change in the relative dielectric permittivity and the dissipation factor frequency dependences.

Библиографическая запись: Alhaj Hasan, A. Frequency Characteristics of PCB with Modal Reservation before and after Failure Using TALGAT [Electronic resource] / A. Alhaj Hasan, T. R. Gazizov // Proceedings of the 2022 IEEE 23rd International Conference of Young Professionals in Electron Devices and Materials (EDM) (Altai, Russian Federation, 30 June 2022 - 04 July 2022). – New York City : IEEE, 2022. – P. 140-146. – DOI: 10.1109/EDM55285.2022.9855089

Конференция:

• 2022 IEEE 23rd International Conference of Young Professionals in Electron Devices and Materials (EDM)
• Россия, Республика Алтай, Горно-Алтайск, 30 июня-04 июля 2022,
• Международная

Издательство:

IEEE

США, New York, New York City