Результаты научной деятельности
Frequency Characteristics of PCB with Modal Reservation before and after Failure Using TALGAT
Статья в сборнике трудов конференции
2022 IEEE 23rd International Conference of Young Professionals in Electron Devices and Materials (EDM)
2022
Опубликовано
11 месяцев назад
Measuring the Level of Radiated Emissions from PCBs with Modal Reservation before and after Failure
Статья в сборнике трудов конференции
2022 International Conference on Actual Problems of Electron Devices Engineering (APEDE)
2022
Опубликовано
11 месяцев назад
TEM-cell Measurements of the Radiated Emissions from PCBs with Modal Reservation before and after Failure
Статья в сборнике трудов конференции
2022 International Ural Conference on Electrical Power Engineering (UralCon)
2022
Опубликовано
11 месяцев назад
Measuring Frequency Characteristic of PCBs with Modal Reservation under Climatic Impact before and after Short Circuit Failure
Статья в сборнике трудов конференции
2022 Dynamics of Systems, Mechanisms and Machines (Dynamics)
2022
Опубликовано
11 месяцев назад
Measuring Frequency Characteristic of PCBs with Modal Reservation under Climatic Impact
Статья в сборнике трудов конференции
2022 IEEE International Multi-Conference on Engineering, Computer and Information Sciences (SIBIRCON)
2022
Опубликовано
11 месяцев назад
Measuring Frequency Characteristics of PCBs with Modal Reservation before and after Open Circuit Failure under Climatic Impact
Статья в сборнике трудов конференции
2022 International Siberian Conference on Control and Communications (SIBCON)
2022
Опубликовано
11 месяцев назад
Ensuring the Reliability and EMC by Modal Reservation: A Brief History and Recent Advances
Статья в журнале
Symmetry
2022
Опубликовано
11 месяцев назад
Attenuating Ultra-Short Pulses in Coplanar Waveguide Modal Filters
Статья в сборнике трудов конференции
2023 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM)
2023
Опубликовано
11 месяцев назад
Analyzing the Capacitance Coupling of Electrodes with a Solder Layer on the Transistor Footprint
Статья в сборнике трудов конференции
2023 IEEE 24th International Conference of Young Professionals in Electron Devices and Materials (EDM)
2023
Опубликовано
11 месяцев назад